TSMC has begun in mid-April to provide fingerprint sensor assembly for Apple iPhone 6, iPad Air 2, third-generation iPad mini, back-end services outsourced to Xintec, Suzhou Jing Fang two semiconductor manufacturers. According to informed sources pointed out that mainland China, Suzhou Jing Fang semiconductors, TSMC has delivered the first batch of the product. Prior to Apple and TSMC have reached an agreement by the latter to continue using an 8-inch fab manufacturing for the next generation iPhone fingerprint sensor, rather than the decision of 12 inches.
This report corroborates a recent discovery of references to Touch ID support for iPads in iOS 7.1. Apple is expected to launch updated iPads in the third quarter of this year.